NORWOOD, MA, UNITED STATES, March 19, 2025 /ennovaterz/ — Advanced Thermal Solutions, Inc. (ATS) has introduced a line of heat sinks developed specifically for cooling AMD Kria™ K26 SOMs. Kria K26 SOMs provide leading vision AI performance, and performance per watt compared to competitive SOMs.
The new ATS black anodized, aluminum heat sinks feature straight fin or ATS maxiFLOW spread fin designs. Lower profile versions are included. Each heat sink comes with a mounting hardware kit for direct attachment to the standard K26 SOM heat spreader plate. A high-performance thermal interface material (TIM) is pre-assembled on the attachment side of the heat sink.
The new sinks are provided in four passive (no fan) and two active (fan attached) versions. Active heat sinks come with hardware for attaching customer-selected fans to match performance needs. ATS includes a list of recommended fan suppliers.
Passive versions can remove 20 W of heat from the AMD module with incoming airflow of 300 LFM (linear feet/minute). The active heat sink version, with a top-mounted fan, delivers 4 CFM (cubic feet/minute) of air to remove 16-18 W of heat. Thermal resistance of these heat sinks is 1.2°C/W in a passive air environment of 100-300 LFM depending on the heat sink type.
Offered in commercial and industrial grades, the Kria K26 SOM features a custom-built AMD Zynq™ UltraScale+™ MPSoC device in a small form factor card ideal for production deployment in smart camera, embedded vision, security, retail analytics, and smart city applications.
The Kria SOM heat sink pages on the ATS website, qats.com, include a calculator for customers to input power and ambient temperature data for their applications. The calculator shows the temperatures the heat sink will keep the module under different airflows.
ATS heat sinks for Kria K26 SOMs are available through ATS’ authorized distribution network, including Avnet, who is also a member of the AMD Adaptive Computing Partner Program.
